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IPB03N03LA G

IPB03N03LA G

  • 厂商:

    EUPEC(英飞凌)

  • 封装:

    TO263-3

  • 描述:

    MOSFET N-CH 25V 80A TO263-3

  • 数据手册
  • 价格&库存
IPB03N03LA G 数据手册
IPB03N03LA G OptiMOS®2 Power-Transistor Product Summary Features • Ideal for high-frequency dc/dc converters • Qualified according to JEDEC1) for target applications V DS 25 V R DS(on),max (SMD version) 2.7 mΩ ID 80 A • N-channel - Logic level • Excellent gate charge x R DS(on) product (FOM) • Very low on-resistance R DS(on) PG-TO263-3-2 • Superior thermal resistance • 175 °C operating temperature • dv /dt rated • Pb-free lead plating; RoHS compliant Type Package Marking IPB03N03LA G PG-TO263-3-2 03N03LA Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Conditions Continuous drain current ID Value T C=25 °C2) 80 T C=100 °C 80 Pulsed drain current I D,pulse T C=25 °C3) 385 Avalanche energy, single pulse E AS I D=80 A, R GS=25 Ω 960 Reverse diode dv /dt dv /dt I D=80 A, V DS=20 V, di /dt =200 A/µs, T j,max=175 °C 6 Gate source voltage4) V GS Power dissipation P tot Operating and storage temperature T j, T stg T C=25 °C IEC climatic category; DIN IEC 68-1 1) Rev. 1.6 Unit A mJ kV/µs ±20 V 150 W -55 ... 175 °C 55/175/56 J-STD20 and JESD22 page 1 2006-05-10 IPB03N03LA G Parameter Values Symbol Conditions Unit min. typ. max. - - 1 minimal footprint - - 62 6 cm2 cooling area5) - - 40 25 - - Thermal characteristics Thermal resistance, junction - case R thJC SMD version, device on PCB R thJA K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D=1 mA Gate threshold voltage V GS(th) V DS=V GS, I D=100 µA 1.2 1.6 2 Zero gate voltage drain current I DSS V DS=25 V, V GS=0 V, T j=25 °C - 0.1 1 V DS=25 V, V GS=0 V, T j=125 °C - 10 100 V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 10 100 nA Drain-source on-state resistance R DS(on) V GS=4.5 V, I D=55 A, SMD version - 3.3 4.1 mΩ V GS=10 V, I D=55 A, SMD version - 2.2 2.7 - 0.9 - Ω 56 112 - S Gate resistance RG Transconductance g fs |V DS|>2|I D|R DS(on)max, I D=55 A 2) Current is limited by bondwire; with an R thJC=1 K/W the chip is able to carry 175 A. 3) See figure 3 4) T j,max=150 °C and duty cycle D
IPB03N03LA G 价格&库存

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